document.write('The communication chip products include 2.5G, 10G and 25G DFB laser chips. The chip structure adopts the structural design of multiple quantum wells (MQW) and ridge waveguide (RWG). Through the composition and stress modulation of multi-component compounds, the product features low threshold, high slope efficiency and high reliability. The product wavelength covers 18 wavebands (1270nm~1610nm) of CWDM communication, and is widely used in 5G communication, data center and other fields.